Emerson Launches Heat Staking Technology

Technology and engineering company Emerson, St. Louis, Missouri, has introduced heat staking technology designed to give manufacturers greater design freedom by enabling them to join more complex, delicate and sensitive components to plastic moldings. Using a unique pulse staking technology that optimizes the heat staking process, the Branson™ GPX platform produces high-quality joins, superior product aesthetics and energy savings in increasingly challenging applications.

The Branson GPX platform uses PulseStaker technology to provide instantaneous heating and cooling, with adjustable cycle times for optimized, low energy heat staking. The process creates no particulates or burn marks, and it enables more delicate and sensitive parts, such as those with embedded electronics, to be joined with consistently high-performance finishes.

The advanced technology is suitable for all heat staking applications, including those with thermoplastic materials and metalized coated parts. A wide range of heat staking tip designs are available, which can be adapted to meet any stake welding requirement, and the ability to stake multiple points simultaneously provides manufacturers with greater design freedom.

For more information, visit www.Emerson.com/Branson.