Labelexpo Announces North America Summer Roadshows

A series of free roadshows in selected cities across North America, organized by Labelexpo Global Series, will give label, packaging and commercial printers a sneak peek into the technology on show at Labelexpo Americas 2022 later this year.

The roadshows will take place in Cincinnati, Ohio; Orange County, California; and Toronto, Canada, and are only open to printers, end users and trade press. The roadshows are supported by Gold sponsors HP, Epson and ABG and Silver sponsor Xeikon.

The roadshow kicks off in Orange County on July 20, hosted by Fullerton College. Working closely with the Printing Industries Association of Southern California (PIASC), this roadshow will provide unique insights on the workforce issues surrounding the labels and package print industries. Printers will also hear about trends and case studies throughout the one-day conference program.

The Cincinnati leg of the roadshow takes place on July 28 and will be hosted by Haney Packaging. Haney Packaging describes itself as a “packaging micro-factory,” providing a one-stop shop from pack development to prototype, test marketing and everything in between. Micro factory customers have access to what Haney describes as “the industry’s largest library of recyclable and compostable packaging solutions.” The roadshow will include a tour of Haney’s impressive facility, while supplier partners will cover industry trends, end-user case studies and specialist technical subjects in the one-day conference program.

The final leg of the roadshow takes place in Toronto on August 3 at the High Park Brewery. Roadshow delegates will hear about their partnership with a local designer and printer to develop a new identity for the brewery which includes their community links and commitment to sustainability. This will complement a core program focusing on trends and key technology advances in label printing.

For more information or to register, visit